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SQM48T/S20 DC-DC Converter Data Sheet
36-75 VDC Input; 1.2-3.3 VDC @ 20A Outputs
The following pages contain specific plots or
waveforms associated with the converter. Additional
comments for specific data are provided below.
Test Conditions
All data presented were taken with the converter
soldered to a test board, specifically a 0.060” thick
printed wiring board (PWB) with four layers. The top
and bottom layers were not metalized. The two inner
layers, comprising two-ounce copper, were used to
provide traces for connectivity to the converter.
The lack of metalization on the outer layers as well
as the limited thermal connection ensured that heat
transfer from the converter to the PWB was
minimized. This provides a worst-case but consistent
scenario for thermal derating purposes.
All measurements requiring airflow were made in the
vertical and horizontal wind tunnel using Infrared (IR)
thermography and thermocouples for thermometry.
Ensuring components on the converter do not
exceed their ratings is important to maintaining high
reliability. If one anticipates operating the converter
at or close to the maximum loads specified in the
derating curves, it is prudent to check actual
operating temperatures in the application.
Thermographic imaging is preferable; if this capability
is not available, then thermocouples may be used. It
is recommended the use of AWG #40 gauge
thermocouples to ensure measurement accuracy.
Careful routing of the thermocouple leads will further
minimize measurement error. Refer to Fig. E for
optimum measuring thermocouple locations.
(i) The output current at which any FET junction
temperature does not exceed a maximum specified
temperature (120 °C) as indicated by the thermo-
graphic image, or
(ii) The nominal rating of the converter (20 A on 3.3 –
1.2 V).
During normal operation, derating curves with
maximum FET temperature less or equal to 120 °C
should not be exceeded. Temperature on the PCB at
thermocouple location shown in Fig. E should not
exceed 120 °C in order to operate inside the derating
curves.
Efficiency
Efficiency vs. load current plot is shown in Fig. x.2 for
ambient temperature of 25 oC, airflow rate of 300 LFM
(1.5 m/s), vertical converter mounting, and input
voltages of 36 V, 48 V and 72 V.
Start-up
Output voltage waveforms, during the turn-on
transient using the ON/OFF pin for full rated load
currents (resistive load) are shown without and with
external load capacitance in Fig. x.3 and Fig. x.4,
respectively.
Ripple and Noise
Fig. x.7 shows the output voltage ripple waveform,
measured at full rated load current with a 10 μF
tantalum and 1 μF ceramic capacitor across the
output. Note that all output voltage waveforms are
measured across a 1 ? F ceramic capacitor.
The input reflected ripple current waveforms are
obtained using the test setup shown in Fig x.8. The
corresponding waveforms are shown in Fig. x.9 and
Fig. x.10.
Fig. E: Locations of the thermocouples for thermal testing.
Thermal Derating
Load current vs. ambient temperature and airflow
rates are given in Fig. x.1 for through-hole version.
Ambient temperature was varied between 25°C and
85°C, with airflow rates from 30 to 500 LFM (0.15 to
2.5 m/s), and vertical converter mounting.
For each set of conditions, the maximum load current
was defined as the lowest of:
MCD10208 Rev. 1.0, 08-Jul-10
Page 6 of 33
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